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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only BIPOLAR TYPE LED LAMPS LSRDGM22841/S10 DATA SHEET DOC. NO : REV. DATE : : QW0905- LSRDGM22841/S10 A 02 - Nov. - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSRDGM22841/S10 Page 1/5 Package Dimensions 4.0 3.8 6.3 1.5MAX 25.0MIN DGM 0.5 TYP 1.0MIN 2.54TYP 1 SR 2 1 2 Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation Vertical Axis 116 0 Horizontal Axis 74 -30 30 -60 60 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSRDGM22841/S10 Page 2/4 Absolute Maximum Ratings at Ta=25 Ratings Parameter Symbol SR Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 100 100 10 ---20 ~ +80 -30 ~ +100 Max 260 for 5 sec Max (2mm from body) DGM 30 100 120 50 150 mA mA mW UNIT A V Static Electricity or power surge will the Use of anti-electrosatic * glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded. Typical Electrical & Optical Characteristics (Ta=25 ) PART NO COLOR MATERIAL Pnm Peak Dominant Spectral wave wave halfwidth length length nm Forward Luminous intensity voltage @20mA(mcd) @20mA(V) Min. Typ. Max. Min. Dnm Viewing angle 21/2 (deg) Emitted GaAlAs LSRDGM22841/S10 InGaN/GaN Lens 660 Green Transparent Typ. Vertical Axis74 Red --- 20 1.5 --- 2.4 ---( * ) ---( * ) Green 518 525 36 --- 3.5 4.0 350 660 Horizontal Axis116 * SR Chip Only Electrical Cogitation and no Luminous intensity Cogitation Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LSRDGM22841/S10 Page 3/5 Typical Electro-Optical Characteristics Curve SR CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 1000 Forward Current(mA) 100 Relative Intensity Normalize @20mA 2.5 2.0 1.5 1.0 0.5 0.0 10 1.0 0.1 1.0 2.0 3.0 4.0 5.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25 Relative Intensity@20mA Normalize @25 80 100 1.2 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 Ambient Temperature() Ambient Temperature() Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 0.5 0.0 600 650 700 750 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSRDGM22841/S10 Page4/5 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000 3.0 Forward Current(mA) 100 Relative Intensity Normalize @20mA 2.0 3.0 4.0 5.0 2.5 2.0 1.5 1.0 0.5 0.0 10 1.0 0.1 1.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Forward Voltage@20mA Normalize @25 Relative Intensity@20mA Normalize @25 1.1 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Ambient Temperature() Ambient Temperature() Fig.5 Relative Intensity vs. Wavelength 1.0 Relative Intensity@20mA 0.5 0.0 450 500 550 600 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSRDGM22841/S10 Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 5 2.Dwell time= 10 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 5 2.Dwell time=5 1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 |
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